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TitleLow-Cost Non-Contact PCBs Temperature Monitoring and Control in a Hot Air Reflow Process Based on Multiple Thermocouples Data Fusion
Author (Name in English or Pinyin)
Date Issued2021
Source PublicationIEEE Access
ISSN2169-3536
DOI10.1109/ACCESS.2020.3036527
Indexed BySCIE
Firstlevel Discipline计算机科学技术
Education discipline科技类
Published range国外学术期刊
Volume Issue Pages卷: 9 页: 123566-123574
References
[1] D. Whalley, D. Williams, and P. Conway, "Thermal modelling of temperature development during the reflow soldering of smd assemblies, " in Proc. 6th ISHM Int. Microelectron. Conf., 1990, pp. 385-394.
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Cited Times [WOS]:0   [WOS Record]     [Related Records in WOS]
Document TypeJournal article
Identifierhttps://irepository.cuhk.edu.cn/handle/3EPUXD0A/2432
CollectionSchool of Science and Engineering
Corresponding AuthorLam, Tin Lun
Affiliation
1.Shenzhen 3irobotix Co Ltd, Shenzhen 518040, Peoples R China
2.Chinese Univ Hong Kong , Sch Sci & Engn, Shenzhen 518172, Peoples R China
Recommended Citation
GB/T 7714
Lam, Tin Lun. Low-Cost Non-Contact PCBs Temperature Monitoring and Control in a Hot Air Reflow Process Based on Multiple Thermocouples Data Fusion[J]. IEEE Access,2021.
APA Lam, Tin Lun. (2021). Low-Cost Non-Contact PCBs Temperature Monitoring and Control in a Hot Air Reflow Process Based on Multiple Thermocouples Data Fusion. IEEE Access.
MLA Lam, Tin Lun."Low-Cost Non-Contact PCBs Temperature Monitoring and Control in a Hot Air Reflow Process Based on Multiple Thermocouples Data Fusion".IEEE Access (2021).
Files in This Item:
File Name/Size DocType File Type Version Access License
Low-Cost Non-Contact(1149KB)Journal article--Published draftRestricted AccessCC BY-NC-SA
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